Description

Description:

Experience Required:

  • Minimum of 7 years’ experience with complex analog, power, high speed digital, or RF PWB designs
  • Demonstrated teamwork, coordination, and communication skills both locally and globally.
  • Demonstrated IPC PWB design principles knowledge.
  • Demonstrated ability to lead and supervise a team of eCAD designers or external vendors.
  • Demonstrated experience with circuit stack-ups and routing with 2 to 14+ layers.
  • Experience with Cadence CAD capture and design tools
  • Demonstrated experience with micro-vias, very fine pitch devices, and high-density processors/FPGAs (>1000 contact BGAs)
  • Demonstrated experience with signal integrity constraints management.

Roles & Responsibilities:

  • Packaging circuit boards into mechanical enclosures and assemblies leveraging Cadence Design tools and IPC standards.
  • Guide engineers in component selection, placement, stack-up and material cost, routing, in-circuit test point location, artwork generation, assembly drawing creation, manufacturing documentation, archival and configuration control
  • Work with global suppliers and create design outputs with a global team.
  • Review external supplier layout designs to ensure high quality, as needed.
  • Take ownership for business objectives including delivery, EHS, productivity, cost management, serviceability, quality. 
  • Little to no direction is given in execution of job-related activities.
  • Comply with EHS regulations and policies.

Education

Any Graduate