HW Engineer Lead

• Job Role
• HW design and development by using 16bit/32 bit /64bits microcontroller/microprocessor for embedded system
• Owning & maintaining detailed schematics, components library, BOM Requirement and design documents for designed module.
• Provide PCB layout design guidelines to PCB designers and maintain Gerbers files
• Perform component selection keeping in consideration of optimized cost / EOL and applicable compliance for NPDs
• Provide detailed component analysis, tolerance analysis, simulations
• Preparation of Functional test plans and Pre-Compliance test plan for designed module
• Troubleshooting hardware, debug firmware and optimize performance.
• Work closely with test labs for agency certifications like FCC/CE/UL/FM, etc.
• Follow internal hardware and firmware development processes
• Ability to communicate concepts, unit and system level hardware design, design validation test results and progress of projects to core team
• Experience:
• 7 to 11 yrs. of total work Experience
• Required Technical Skills:
  
   

The experience and skills required include but are not limited to the following:

 

• Strong knowledge mixed signal embedded system design by using 16 bit/16/32-bit micro controllers or processors e.g ATSAM54XXseries, TIs -AM43xx/335/62X, SOMs like QualComm XR2 or similar
• Hands on experience in interfacing of highspeed devices -like DDR4/DDR3 /USB/Ethernet etc
• Thorough experience in evaluating and interacting various types of displays Interfaces (LCD touch screen)
• Hands on experience in evaluating and design/dev of different Wireless (Wi-Fi/BLE/Cellular) technologies
• Hands on experience of design & debugging different communication interfaces like I2C, SPI, RS232, RS485, CAN, BLE, external memories, LCD & touch screen interfaces etc.
• Proficiency in Schematic capture tools like Orcad/PADs.
• Proficiency in circuit analysis, circuit simulation using PSpice/spice / and circuit tolerance analysis is must. Hands on experience - design adhere to applicable EMC-EMI guidelines (IEC61XXXX, )
• Hands on experience in evaluating and interacting with various types of cameras
• Thorough experience in dealing/guiding PCB designer for multilayer highspeed boards
• Knowledge of Signal Integrity concept specific to DDR3/DDR4
• Academic Qualifications
• BE/BTech/ME/MTech in Electrical and Electronics Engineering (EEE) or Electronics and Communication Engineering (ECE) or Electronics & Instrumentation Engineering from an accredited university/college.