QUALIFICATION: 4-12+ YEARS EXPERIENCE BTech/MTech in Microelectronics, Electrical Engineering or Computer Science. Other Science graduates would be considered if they have relevant experience
REQUIREMENTS
Hiring for Senior Engineer, Technical Lead, and Architect levels
Hands-on experience in handling block/chip level implementation from Netlist to GDSII
Must possess hands on experience in timing closure and physical verification closure
Experience in handling lower tech nodes that include 7nm, 10nm, 16nm, 28nm 40nm, etc.
Must have hands on tape-out experience in lower tech nodes in any of the tools mentioned such ICC/ICC2, Fusion Compiler or Innovus
Must have the ability to think on the spot for quick solutions and work-around at the time of tapeout to hit the schedule on time
Must possess excellent scripting skills – TCL or Perl or Python
Experience in Synthesis and Formal is a plus
RESPONSIBILITIES
Participate at either the IP or SOC level with opportunity for change in focus as projects needs allow
Partner with other engineers from the design team and other disciplines to define and develop ASIC physical designs. This would include physical designers from both SOC and IP
Participate in defining flows, methods, select tools, drive continual improvement, and closure of issues