Description

  • QUALIFICATION: 4-12+ YEARS EXPERIENCE
    BTech/MTech in Microelectronics, Electrical Engineering or Computer Science. Other Science graduates would be considered if they have relevant experience

 

REQUIREMENTS

  • Hiring for Senior Engineer, Technical Lead, and Architect levels
  • Hands-on experience in handling block/chip level implementation from Netlist to GDSII
  • Must possess hands on experience in timing closure and physical verification closure
  • Experience in handling lower tech nodes that include 7nm, 10nm, 16nm, 28nm 40nm, etc.
  • Must have hands on tape-out experience in lower tech nodes in any of the tools mentioned such ICC/ICC2, Fusion Compiler or Innovus
  • Must have the ability to think on the spot for quick solutions and work-around at the time of tapeout to hit the schedule on time
  • Must possess excellent scripting skills – TCL or Perl or Python
  • Experience in Synthesis and Formal is a plus

RESPONSIBILITIES

  • Participate at either the IP or SOC level with opportunity for change in focus as projects needs allow
  • Partner with other engineers from the design team and other disciplines to define and develop ASIC physical designs. This would include physical designers from both SOC and IP
  • Participate in defining flows, methods, select tools, drive continual improvement, and closure of issues
  • Work with advanced process node technology

Key Skills
Education

Any Graduate