Description

About the job
Competent skills and experience with ECAD software applications and related equipment.

Specific experience with EDA tool is required.
Competent experience and knowledge of PCB design technologies, PCB layout techniques, electrical schematics, PCB fabrication and assembly drawings is required.
Designing multilayer high-density interconnect printed circuits often consisting of multiple lamination cycles and via structures up to 12 layers.
• Expertise in design of multi-lam, blind and buried via, and sub .5mm pitch applications.
• Performing to schedules and ensuring timelines are met by working closely with a team of PCB designers and Design Engineers.
• Develop and generate drawings and documentation to facilitate PCB fabrication and assembly.

Qualification:
B.E
 

Education

Any Graduate